338-BESV Процессор Intel E3-1270V3 3.50GHz 4C 8M 80W
26 742
руб.
Есть в наличии
Количество:
Артикул:
338-BESV
Processor Socket:
LGA 1150 (Socket H3)
Тип товара:
Процессор
Альтернативные партийные номера:
Краткое описание: DELL 338-BESV - Intel E3-1270V3 3.50GHz 4C 8M 80W - Same Day Express Shipping offered Worldwide
brand_ice: DELL
Co2 Savings: 6.72
Processor family: Xeon E3-V3
Processor model: E3-1270V3
Processor base frequency: 3.5 GHz
Processor frequency: 3.5 GHz
Processor cores: 4
Processor socket: LGA 1150 (Socket H3)
Processor lithography: 22 nm
Box: No
Component for: Server/workstation
Processor threads: 8
Processor operating modes: 64-bit
Processor boost frequency: 3.9 GHz
Processor cache: 8 MB
Processor cache type: L3
Thermal Design Power (TDP): 80 W
Stepping: C0
Bus type: QPI
Number of QPI links: 1
Memory bandwidth supported by processor (max): 25.6 GB/s
Maximum internal memory supported by processor: 32 GB
Memory types supported by processor: DDR3-SDRAM
Memory clock speeds supported by processor: 1333,1600 MHz
Memory channels: Dual-channel
ECC: Yes
Memory channels supported by processor: Dual
ECC supported by processor: Yes
On-board graphics card: No
Thermal Monitoring Technologies: Yes
Execute Disable Bit: Yes
Idle States: Yes
Market segment: Server
Maximum number of PCI Express lanes: 16
PCI Express slots version: 3.0
PCI Express configurations: 1x16, 2x8, 1x8+2x4
Supported instruction sets: AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification: PCG 2013D
Graphics & IMC lithography: 22 nm
CPU configuration (max): 1
Embedded options available: No
Intel® Smart Cache: Yes
Intel® AES New Instructions (Intel® AES-NI): Yes
Intel Trusted Execution Technology: Yes
Enhanced Intel SpeedStep Technology: Yes
Intel® Hyper Threading Technology (Intel® HT Technology): Yes
Intel® Turbo Boost Technology: 2.0
Intel® Identity Protection Technology (Intel® IPT): Yes
Intel VT-x with Extended Page Tables (EPT): Yes
Intel Enhanced Halt State: Yes
Intel TSX-NI: Yes
Intel® Secure Key: Yes
Intel Virtualization Technology (VT-x): Yes
Intel Virtualization Technology for Directed I/O (VT-d): Yes
Intel® Virtualization Technology (Intel® VT): VT-d, VT-x
brand_ice: DELL
Co2 Savings: 6.72
Processor family: Xeon E3-V3
Processor model: E3-1270V3
Processor base frequency: 3.5 GHz
Processor frequency: 3.5 GHz
Processor cores: 4
Processor socket: LGA 1150 (Socket H3)
Processor lithography: 22 nm
Box: No
Component for: Server/workstation
Processor threads: 8
Processor operating modes: 64-bit
Processor boost frequency: 3.9 GHz
Processor cache: 8 MB
Processor cache type: L3
Thermal Design Power (TDP): 80 W
Stepping: C0
Bus type: QPI
Number of QPI links: 1
Memory bandwidth supported by processor (max): 25.6 GB/s
Maximum internal memory supported by processor: 32 GB
Memory types supported by processor: DDR3-SDRAM
Memory clock speeds supported by processor: 1333,1600 MHz
Memory channels: Dual-channel
ECC: Yes
Memory channels supported by processor: Dual
ECC supported by processor: Yes
On-board graphics card: No
Thermal Monitoring Technologies: Yes
Execute Disable Bit: Yes
Idle States: Yes
Market segment: Server
Maximum number of PCI Express lanes: 16
PCI Express slots version: 3.0
PCI Express configurations: 1x16, 2x8, 1x8+2x4
Supported instruction sets: AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification: PCG 2013D
Graphics & IMC lithography: 22 nm
CPU configuration (max): 1
Embedded options available: No
Intel® Smart Cache: Yes
Intel® AES New Instructions (Intel® AES-NI): Yes
Intel Trusted Execution Technology: Yes
Enhanced Intel SpeedStep Technology: Yes
Intel® Hyper Threading Technology (Intel® HT Technology): Yes
Intel® Turbo Boost Technology: 2.0
Intel® Identity Protection Technology (Intel® IPT): Yes
Intel VT-x with Extended Page Tables (EPT): Yes
Intel Enhanced Halt State: Yes
Intel TSX-NI: Yes
Intel® Secure Key: Yes
Intel Virtualization Technology (VT-x): Yes
Intel Virtualization Technology for Directed I/O (VT-d): Yes
Intel® Virtualization Technology (Intel® VT): VT-d, VT-x
DELL Intel Xeon E3-1270 v3. Processor family: Intel® Xeon® E3 V3 Family, Processor socket: LGA 1150 (Socket H3), Processor lithography: 22 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 32 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: AVX 2.0, SSE4.1, SSE4.2. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
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BoxNo
-
Bus typeQPI
-
Co2 Savings6.72
-
Component forServer/workstation
-
CPU configuration (max)1
-
ECCYes
-
ECC supported by processorYes
-
Embedded options availableNo
-
Enhanced Intel SpeedStep TechnologyYes
-
Execute Disable BitYes
-
Graphics & IMC lithography22 nm
-
Idle StatesYes
-
Intel Enhanced Halt StateYes
-
Intel Trusted Execution TechnologyYes
-
Intel TSX-NIYes
-
Intel Virtualization Technology (VT-x)Yes
-
Intel Virtualization Technology for Directed I/O (VT-d)Yes
-
Intel VT-x with Extended Page Tables (EPT)Yes
-
Intel® AES New Instructions (Intel® AES-NI)Yes
-
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
-
Intel® Identity Protection Technology (Intel® IPT)Yes
-
Intel® Secure KeyYes
-
Intel® Smart CacheYes
-
Intel® Turbo Boost Technology2
-
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
-
Market segmentServer
-
Maximum internal memory supported by processor32 GB
-
Maximum number of PCI Express lanes16
-
Memory bandwidth supported by processor (max)25.6 GB/s
-
Memory channelsDual-channel
-
Memory channels supported by processorDual
-
Memory clock speeds supported by processor1333,1600 MHz
-
Memory types supported by processorDDR3-SDRAM
-
Number of QPI links1
-
On-board graphics cardNo
-
PCI Express configurations1x16, 2x8, 1x8+2x4
-
PCI Express slots version3
-
Processor base frequency3.5 GHz
-
Processor boost frequency3.9 GHz
-
Processor cache8 MB
-
Processor cache typeL3
-
Processor cores4
-
Processor familyXeon E3-V3
-
Processor frequency3.5 GHz
-
Processor lithography22 nm
-
Processor modelE3-1270V3
-
Processor operating modes64-bit
-
Processor SocketLGA 1150 (Socket H3)
-
Processor threads8
-
SteppingC0
-
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
-
Thermal Design Power (TDP)80 W
-
Thermal Monitoring TechnologiesYes
-
Thermal solution specificationPCG 2013D
-
ПроизводительDell
-
Тип товараПроцессор
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