4XG7A07238 Процессор

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Количество:
  • Производитель: LENOVO
Артикул:
4XG7A07238
Processor Socket:
LGA 3647 (Socket P)
Тип товара:
Процессор
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Краткое описание: Intel Xeon Platinum 8160 24C 150W 2.1GHz ThinkSystem SR570 Processor Option Kit

brand_ice: LENOVO
Co2 Savings: 6.72
Processor family: Xeon Platinum
Processor generation: 1st Generation Intel® Xeon® Scalable
Processor model: 8160
Processor base frequency: 2.1 GHz
Processor cores: 24
Processor socket: LGA 3647 (Socket P)
Processor lithography: 14 nm
Cooler included: Yes
Component for: Server/workstation
Processor threads: 48
Processor operating modes: 64-bit
Processor boost frequency: 3.7 GHz
Processor cache: 33 MB
Processor cache type: L3
Thermal Design Power (TDP): 150 W
Stepping: H0
Bus type: UPI
Processor codename: Skylake
Maximum internal memory supported by processor: 768 GB
Memory types supported by processor: DDR4-SDRAM
Memory clock speeds supported by processor: 2666 MHz
Memory channels: Hexa-channel
ECC: Yes
On-board graphics card: No
Execute Disable Bit: Yes
Market segment: Server
Maximum number of PCI Express lanes: 48
PCI Express slots version: 3.0
Scalability: S8S
Embedded options available: No
Intel® Speed Shift Technology: Yes
Intel® AES New Instructions (Intel® AES-NI): Yes
Intel Trusted Execution Technology: Yes
Enhanced Intel SpeedStep Technology: Yes
Intel® Hyper Threading Technology (Intel® HT Technology): Yes
Intel® Turbo Boost Technology: 2.0
Conflict-Free processor: Yes
Intel Turbo Boost Max Technology 3.0: No
Intel® Optane™ Memory Ready: No
Intel® vPro™ Platform Eligibility: Yes
Intel 64: Yes
Intel VT-x with Extended Page Tables (EPT): Yes
Intel TSX-NI: Yes
Intel Virtualization Technology (VT-x): Yes
Intel Virtualization Technology for Directed I/O (VT-d): Yes
Tcase: 85 °C

Lenovo Intel Xeon Platinum 8160. Processor family: Intel® Xeon® Platinum, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: S8S

For the SR570 server models that come standard with one processor, the second processor can be ordered, if required. The second processor must be of the same model as the first processor. The second processor option includes a processor, a heatsink, and two additional single-rotor system fans.

  • Bus type
    UPI
  • Co2 Savings
    6.72
  • Component for
    Server/workstation
  • Conflict-Free processor
    Yes
  • Cooler included
    Yes
  • ECC
    Yes
  • Embedded options available
    No
  • Enhanced Intel SpeedStep Technology
    Yes
  • Execute Disable Bit
    Yes
  • Intel 64
    Yes
  • Intel Trusted Execution Technology
    Yes
  • Intel TSX-NI
    Yes
  • Intel Turbo Boost Max Technology 3.0
    No
  • Intel Virtualization Technology (VT-x)
    Yes
  • Intel Virtualization Technology for Directed I/O (VT-d)
    Yes
  • Intel VT-x with Extended Page Tables (EPT)
    Yes
  • Intel® AES New Instructions (Intel® AES-NI)
    Yes
  • Intel® Hyper Threading Technology (Intel® HT Technology)
    Yes
  • Intel® Optane™ Memory Ready
    No
  • Intel® Speed Shift Technology
    Yes
  • Intel® Turbo Boost Technology
    2
  • Intel® vPro™ Platform Eligibility
    Yes
  • Market segment
    Server
  • Maximum internal memory supported by processor
    768 GB
  • Maximum number of PCI Express lanes
    48
  • Memory channels
    Hexa-channel
  • Memory clock speeds supported by processor
    2666 MHz
  • Memory types supported by processor
    DDR4-SDRAM
  • On-board graphics card
    No
  • PCI Express slots version
    3
  • Processor base frequency
    2.1 GHz
  • Processor boost frequency
    3.7 GHz
  • Processor cache
    33 MB
  • Processor cache type
    L3
  • Processor codename
    Skylake
  • Processor cores
    24
  • Processor family
    Xeon Platinum
  • Processor generation
    1st Generation Intel® Xeon® Scalable
  • Processor lithography
    14 nm
  • Processor model
    8160
  • Processor operating modes
    64-bit
  • Processor Socket
    LGA 3647 (Socket P)
  • Processor threads
    48
  • Scalability
    S8S
  • Stepping
    H0
  • Tcase
    85 °C
  • Thermal Design Power (TDP)
    150 W
  • Производитель
    Lenovo
  • Тип товара
    Процессор
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