4XG7A63473 Процессор SR650 V2 Intel Xeon Gold 6330 28C 205W 2.0GHz Option Kit w/o Fan

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  • Производитель: LENOVO
Артикул:
4XG7A63473
Processor Socket:
LGA 4189
Тип товара:
Процессор
Альтернативные партийные номера:
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Краткое описание: LENOVO 4XG7A63473 - SR650 V2 Intel Xeon Gold 6330 28C 205W 2.0GHz Option Kit w/o Fan - Same Day Express Shipping offered Worldwide

brand_ice: LENOVO
Co2 Savings: 6.72
Processor manufacturer: Intel
Processor family: Xeon Gold
Processor generation: 3rd Generation Intel® Xeon® Scalable
Processor model: 6330
Processor base frequency: 2 GHz
Processor cores: 28
Processor socket: LGA 4189
Processor lithography: 10 nm
Processor series: Intel Xeon Gold 6000 Series
Processor threads: 56
System bus rate: 11.2 GT/s
Processor operating modes: 64-bit
Processor boost frequency: 3.1 GHz
High priority cores: 12
High priority core frequency: 2.1 GHz
Low priority cores: 16
Low priority core frequency: 1.8 GHz
Processor cache: 42 MB
Thermal Design Power (TDP): 205 W
Processor codename: Ice Lake
Maximum internal memory supported by processor: 6 TB
Memory types supported by processor: DDR4-SDRAM
Memory clock speeds supported by processor: 2933 MHz
Memory channels: Octa-channel
ECC: Yes
On-board graphics card: No
Discrete graphics card: No
On-board graphics card model: Not available
Discrete graphics card model: Not available
Execute Disable Bit: Yes
Market segment: Server
Maximum number of PCI Express lanes: 64
PCI Express slots version: 4.0
Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2
Scalability: 2S
Embedded options available: Yes
Intel® Speed Shift Technology: Yes
Intel® AES New Instructions (Intel® AES-NI): Yes
Intel Trusted Execution Technology: Yes
Intel® Hyper Threading Technology (Intel® HT Technology): Yes
Intel® Turbo Boost Technology: 2.0
Intel® Transactional Synchronization Extensions: Yes
Intel® Total Memory Encryption: Yes
Intel® Platform Firmware Resilience Support: Yes
Maximum Enclave Size Support for Intel® SGX: 64 GB
Intel® Crypto Acceleration: Yes
AVX-512 Fused Multiply-Add (FMA) units: 2
Intel® Optane™ DC Persistent Memory Supported: Yes
Intel® Deep Learning Boost (Intel® DL Boost): Yes
Intel® Resource Director Technology (Intel® RDT): Yes
Intel® Volume Management Device (VMD): Yes
Intel® Run Sure Technology: Yes
Mode-based Execute Control (MBE): Yes
Intel 64: Yes
Intel VT-x with Extended Page Tables (EPT): Yes
Intel Software Guard Extensions (Intel SGX): Yes
Intel Virtualization Technology (VT-x): Yes
Intel Virtualization Technology for Directed I/O (VT-d): Yes
Intel® Speed Select Technology – Core Power: Yes
Intel® Speed Select Technology – Turbo Frequency: Yes
Tcase: 86 °C

Lenovo Intel Xeon Gold 6330. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB

ThinkSystem servers incorporate Intel Xeon Scalable Family processors to enable critical business workloads and applications. The Intel scalable design provides significant improvement in performance, advanced reliability, scalability and hardware-enhanced security. Enhancements include higher per-core performance, greater memory bandwidth, expanded I/O, and improved security. This page allows you compare the features of the processors.

  • AVX-512 Fused Multiply-Add (FMA) units
    2
  • Co2 Savings
    6.72
  • Discrete graphics card
    No
  • Discrete graphics card model
    Not available
  • ECC
    Yes
  • Embedded options available
    Yes
  • Execute Disable Bit
    Yes
  • High priority core frequency
    2.1 GHz
  • High priority cores
    12
  • Intel 64
    Yes
  • Intel Software Guard Extensions (Intel SGX)
    Yes
  • Intel Trusted Execution Technology
    Yes
  • Intel Virtualization Technology (VT-x)
    Yes
  • Intel Virtualization Technology for Directed I/O (VT-d)
    Yes
  • Intel VT-x with Extended Page Tables (EPT)
    Yes
  • Intel® AES New Instructions (Intel® AES-NI)
    Yes
  • Intel® Crypto Acceleration
    Yes
  • Intel® Deep Learning Boost (Intel® DL Boost)
    Yes
  • Intel® Hyper Threading Technology (Intel® HT Technology)
    Yes
  • Intel® Optane™ DC Persistent Memory Supported
    Yes
  • Intel® Platform Firmware Resilience Support
    Yes
  • Intel® Resource Director Technology (Intel® RDT)
    Yes
  • Intel® Run Sure Technology
    Yes
  • Intel® Speed Select Technology – Core Power
    Yes
  • Intel® Speed Select Technology – Turbo Frequency
    Yes
  • Intel® Speed Shift Technology
    Yes
  • Intel® Total Memory Encryption
    Yes
  • Intel® Transactional Synchronization Extensions
    Yes
  • Intel® Turbo Boost Technology
    2
  • Intel® Volume Management Device (VMD)
    Yes
  • Low priority core frequency
    1.8 GHz
  • Low priority cores
    16
  • Market segment
    Server
  • Maximum Enclave Size Support for Intel® SGX
    64 GB
  • Maximum internal memory supported by processor
    6 TB
  • Maximum number of PCI Express lanes
    64
  • Memory channels
    Octa-channel
  • Memory clock speeds supported by processor
    2933 MHz
  • Memory types supported by processor
    DDR4-SDRAM
  • Mode-based Execute Control (MBE)
    Yes
  • On-board graphics card
    No
  • On-board graphics card model
    Not available
  • PCI Express slots version
    4
  • Processor base frequency
    2 GHz
  • Processor boost frequency
    3.1 GHz
  • Processor cache
    42 MB
  • Processor codename
    Ice Lake
  • Processor cores
    28
  • Processor family
    Xeon Gold
  • Processor generation
    3rd Generation Intel® Xeon® Scalable
  • Processor lithography
    10 nm
  • Processor manufacturer
    Intel
  • Processor model
    6330
  • Processor operating modes
    64-bit
  • Processor series
    Intel Xeon Gold 6000 Series
  • Processor Socket
    LGA 4189
  • Processor threads
    56
  • Scalability
    2S
  • Supported instruction sets
    AVX, AVX 2.0, AVX-512, SSE4.2
  • System bus rate
    11.2 GT/s
  • Tcase
    86 °C
  • Thermal Design Power (TDP)
    205 W
  • Производитель
    Lenovo
  • Тип товара
    Процессор
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