8731A1G Flex система Lenovo Flex System Manager Node

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Количество:
  • Производитель: LENOVO
Артикул:
8731A1G
Processor Socket:
LGA 2011 (Socket R)
Тип товара:
Flex система
Альтернативные партийные номера:
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Краткое описание: LENOVO 8731A1G - Lenovo Flex System Manager Node - Same Day Express Shipping offered Worldwide

brand_ice: IBM
Co2 Savings: 0
Chassis type: Rack
Processor manufacturer: Intel
Processor family: Xeon E5
Processor model: E5-2650
Processor frequency: 2 GHz
Processor boost frequency: 2.8 GHz
Processor cores: 8
Processor cache: 20 MB
Memory channels supported by processor: Quad
Number of processors installed: 1
Thermal Design Power (TDP): 95 W
Processor cache type: Smart Cache
System bus rate: 8 GT/s
Maximum internal memory supported by processor: 750 GB
Physical Address Extension (PAE): 46 bit
Scalability: 2S
FSB Parity: No
Processor lithography: 32 nm
ECC supported by processor: Yes
Stepping: C2
Memory types supported by processor: DDR3-SDRAM
Thermal Monitoring Technologies: Yes
Processor codename: Sandy Bridge EP
Maximum number of PCI Express lanes: 40
Processor series: Intel Xeon E5-2600
Embedded options available: No
Processor threads: 16
Processor socket: LGA 2011 (Socket R)
Number of QPI links: 2
Memory bandwidth supported by processor (max): 51.2 GB/s
Processor operating modes: 64-bit
Graphics & IMC lithography: 32 nm
Execute Disable Bit: Yes
Memory clock speeds supported by processor: 800,1066,1333,1600 MHz
Idle States: Yes
Tcase: 77.4 °C
Processor package size: 52.5 x 45.0 mm
PCI Express configurations: x4, x8, x16
CPU multiplier (bus/core ratio): 28
Supported instruction sets: AVX
Bus type: QPI
Conflict-Free processor: No
Internal memory: 32 GB
Internal memory type: DDR3-SDRAM
ECC: Yes
Memory slots: 4
Memory clock speed: 1333 MHz
Memory layout: 8 x 4 GB
Maximum internal memory: 384 GB
Total storage capacity: 1.4 TB
Number of hard drives installed: 1
Hard drive capacity: 1 TB
Hard drive interface: Serial ATA, Serial ATA II, Serial ATA III
HDD speed: 7200 RPM
Hard drive size: 2.5"
Supported hard disk drive sizes: 1.8,2.5"
Number of SSDs installed: 2
SSD capacity: 200 GB
Solid-state drive interfaces: SATA III
RAID support: Yes
Optical drive type: No
Ethernet LAN: Yes
Ethernet interface type: 10 Gigabit
Ethernet LAN (RJ-45) ports quantity: 2
USB 2.0 ports quantity: 1
Serial ports quantity: 1
PCI Express slots version: 3.0
Intel® Turbo Boost Technology: 2.0
Intel® Insider™: No
Intel Virtualization Technology (VT-x): Yes
Intel Trusted Execution Technology: Yes
Intel® AES New Instructions (Intel® AES-NI): Yes
Intel Enhanced Halt State: Yes
Intel® Secure Key: Yes
Intel® Hyper Threading Technology (Intel® HT Technology): Yes
Intel Identity Protection Technology version: 0.00
Intel Flex Memory Access: No
Intel Secure Key Technology version: 1.00
Intel Fast Memory Access: No
Processor ARK ID: 64590
CPU configuration (max): 2
Intel® InTru™ 3D Technology: No
Intel Rapid Storage Technology: No
Intel® Identity Protection Technology (Intel® IPT): No
Enhanced Intel SpeedStep Technology: Yes
Intel® Wireless Display (Intel® WiDi): No
Intel® Anti-Theft Technology (Intel® AT): No
Intel Demand Based Switching: Yes
Intel Dual Display Capable Technology: No
Intel FDI Technology: No
Intel Clear Video Technology: No
Intel® Quick Sync Video Technology: No
Intel Virtualization Technology for Directed I/O (VT-d): Yes
Intel TSX-NI version: 0.00
Intel 64: Yes
Intel® Clear Video HD Technology (Intel® CVT HD): No
Intel VT-x with Extended Page Tables (EPT): Yes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID): No
Intel® My WiFi Technology (Intel® MWT): No
Intel® vPro™ Technology: Yes
Operating temperature (T-T): 10 - 35 °C
Storage temperature (T-T): 0 - 60 °C
Operating relative humidity (H-H): 10 - 80%
Operating altitude: 0 - 3048 m
Certification: FCC Part 15 Class A ICES-003, issue 4, Class A UL/IEC 60950-1 CSA C22.2 No. 60950-1 NOM-019 IEC 60950-1 VCCI, Class A IEC 60950-1 CCC (GB4943-2001); (GB9254-2008, Class A); (GB17625.1-2003) BSMI CNS13438, Class A; CNS14336 AS/NZS CISPR 22:2006, Cl
Width: 216 mm
Depth: 317 mm
Height: 56 mm
Weight: 7.1 kg
Intel® Virtualization Technology (Intel® VT): VT-x

IBM Flex System Manager Node. Processor family: Intel® Xeon® E5 Family, Processor frequency: 2 GHz, Processor model: E5-2650. Internal memory: 32 GB, Internal memory type: DDR3-SDRAM, Memory layout (slots x size): 8 x 4 GB. Total storage capacity: 1.4 TB, HDD size: 2.5", HDD interface: Serial ATA, Serial ATA II, Serial ATA III. Ethernet LAN. Chassis type: Rack

IBM® Flex System™ Manager (FSM) is a systems management appliance that drives efficiency and cost savings in the data center. IBM Flex System Manager provides a pre-integrated and virtualized management environment across servers, storage, and networking that is easily managed from a single interface. A single focus point for seamless multichassis management provides an instant and resource-oriented view of chassis and chassis resources for both IBM System x® and IBM Power Systems™ compute nodes. You can reduce the number of interfaces, steps, and clicks it takes to manage IT resources, intelligently manage and deploy workloads based on resource availability and predefined policies, and manage events and alerts to increase system availability and reduce downtime while reducing operational costs.

IBM Flex System, a new category of computing and the next generation of Smarter Computing, offers intelligent workload deployment and management for maximum business agility. This chassis delivers high-speed performance complete with integrated servers, storage, and networking for multi-chassis management in data center compute environments. Furthermore, its flexible design can meet the needs of varying workloads with independently scalable IT resource pools for higher utilization and lower cost per workload. While increased security and resiliency protect vital information and promote maximum uptime, the integrated, easy-to-use management system reduces setup time and complexity, providing a quicker path to return on investment (ROI)

  • Bus type
    QPI
  • Certification
    (GB17625.1-2003) BSMI CNS13438, Class A, (GB9254-2008, Class A), CNS14336 AS/NZS CISPR 22:2006, Cl, FCC Part 15 Class A ICES-003, issue 4, Class A UL/IEC 60950-1 CSA C22.2 No. 60950-1 NOM-019 IEC 60950-1 VCCI, Class A IEC 60950-1 CCC (GB4943-2001)
  • Chassis type
    Rack
  • Co2 Savings
    0
  • Conflict-Free processor
    No
  • CPU configuration (max)
    2
  • CPU multiplier (bus/core ratio)
    28
  • Depth
    317 mm
  • ECC
    Yes
  • ECC supported by processor
    Yes
  • Embedded options available
    No
  • Enhanced Intel SpeedStep Technology
    Yes
  • Ethernet interface type
    10 Gigabit
  • Ethernet LAN
    Yes
  • Ethernet LAN (RJ-45) ports quantity
    2
  • Execute Disable Bit
    Yes
  • FSB Parity
    No
  • Graphics & IMC lithography
    32 nm
  • Hard drive capacity
    1 TB
  • Hard drive interface
    Serial ATA, Serial ATA II, Serial ATA III
  • Hard drive size
    2.5"
  • HDD speed
    7200 RPM
  • Height
    56 mm
  • Idle States
    Yes
  • Intel 64
    Yes
  • Intel Clear Video Technology
    No
  • Intel Demand Based Switching
    Yes
  • Intel Dual Display Capable Technology
    No
  • Intel Enhanced Halt State
    Yes
  • Intel Fast Memory Access
    No
  • Intel FDI Technology
    No
  • Intel Flex Memory Access
    No
  • Intel Identity Protection Technology version
    0
  • Intel Rapid Storage Technology
    No
  • Intel Secure Key Technology version
    1
  • Intel Trusted Execution Technology
    Yes
  • Intel TSX-NI version
    0
  • Intel Virtualization Technology (VT-x)
    Yes
  • Intel Virtualization Technology for Directed I/O (VT-d)
    Yes
  • Intel VT-x with Extended Page Tables (EPT)
    Yes
  • Intel® AES New Instructions (Intel® AES-NI)
    Yes
  • Intel® Anti-Theft Technology (Intel® AT)
    No
  • Intel® Clear Video HD Technology (Intel® CVT HD)
    No
  • Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)
    No
  • Intel® Hyper Threading Technology (Intel® HT Technology)
    Yes
  • Intel® Identity Protection Technology (Intel® IPT)
    No
  • Intel® Insider™
    No
  • Intel® InTru™ 3D Technology
    No
  • Intel® My WiFi Technology (Intel® MWT)
    No
  • Intel® Quick Sync Video Technology
    No
  • Intel® Secure Key
    Yes
  • Intel® Turbo Boost Technology
    2
  • Intel® Virtualization Technology (Intel® VT)
    VT-x
  • Intel® vPro™ Technology
    Yes
  • Intel® Wireless Display (Intel® WiDi)
    No
  • Internal memory
    32 GB
  • Internal memory type
    DDR3-SDRAM
  • Maximum internal memory
    384 GB
  • Maximum internal memory supported by processor
    750 GB
  • Maximum number of PCI Express lanes
    40
  • Memory bandwidth supported by processor (max)
    51.2 GB/s
  • Memory channels supported by processor
    Quad
  • Memory clock speed
    1333 MHz
  • Memory clock speeds supported by processor
    800,1066,1333,1600 MHz
  • Memory layout
    8 x 4 GB
  • Memory slots
    4
  • Memory types supported by processor
    DDR3-SDRAM
  • Number of hard drives installed
    1
  • Number of processors installed
    1
  • Number of QPI links
    2
  • Number of SSDs installed
    2
  • Operating altitude
    0 - 3048 m
  • Operating relative humidity (H-H)
    10 - 80%
  • Operating temperature (T-T)
    10 - 35 °C
  • Optical drive type
    No
  • PCI Express configurations
    x4, x8, x16
  • PCI Express slots version
    3
  • Physical Address Extension (PAE)
    46 bit
  • Processor ARK ID
    64590
  • Processor boost frequency
    2.8 GHz
  • Processor cache
    20 MB
  • Processor cache type
    Smart Cache
  • Processor codename
    Sandy Bridge EP
  • Processor cores
    8
  • Processor family
    Xeon E5
  • Processor frequency
    2 GHz
  • Processor lithography
    32 nm
  • Processor manufacturer
    Intel
  • Processor model
    E5-2650
  • Processor operating modes
    64-bit
  • Processor package size
    52.5 x 45.0 mm
  • Processor series
    Intel Xeon E5-2600
  • Processor Socket
    LGA 2011 (Socket R)
  • Processor threads
    16
  • RAID support
    Yes
  • Scalability
    2S
  • Serial ports quantity
    1
  • Solid-state drive interfaces
    SATA III
  • SSD capacity
    200 GB
  • Stepping
    C2
  • Storage temperature (T-T)
    0 - 60 °C
  • Supported hard disk drive sizes
    1.8,2.5"
  • Supported instruction sets
    AVX
  • System bus rate
    8 GT/s
  • Tcase
    77.4 °C
  • Thermal Design Power (TDP)
    95 W
  • Thermal Monitoring Technologies
    Yes
  • Total storage capacity
    1.4 TB
  • USB 2.0 ports quantity
    1
  • Weight
    7.1 kg
  • Width
    216 mm
  • Производитель
    IBM
  • Тип товара
    Flex система
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