I3-550 Процессор

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Количество:
  • Производитель: INTEL
Артикул:
I3-550
Processor Socket:
LGA 1156 (Socket H)
Тип товара:
Процессор
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Краткое описание: Intel® Core™ i3-550 Processor (4M Cache, 3.20 GHz)

brand_ice: INTEL
Co2 Savings: 6.72
Harmonized System (HS) code: 8542310001
Package type: Retail box
Processor manufacturer: Intel
Processor family: Intel® Core™ i3
Processor generation: Intel® Core™ i3
Processor model: i3-550
Processor base frequency: 3.2 GHz
Processor frequency: 3.2 GHz
Processor cores: 2
Processor socket: LGA 1156 (Socket H)
Processor lithography: 32 nm
Box: Yes
Cooler included: Yes
Component for: PC
Processor series: Intel Core i3-500 Desktop Series
Processor threads: 4
System bus rate: 2.5 GT/s
Processor operating modes: 64-bit
Processor cache: 4 MB
Processor cache type: Smart Cache
Thermal Design Power (TDP): 73 W
VID Voltage Range: 0.65 - 1.4 V
Compatible chipsets: Intel® H55 Express, Intel® H57 Express, Intel® P55 Express, Intel® Q57 Express
Stepping: K0
Bus type: DMI
CPU multiplier (bus/core ratio): 24
Memory bandwidth supported by processor (max): 21 GB/s
Processor codename: Clarkdale
Processor code: SLBUD
Processor ARK ID: 48505
Generation: 5th Generation
Maximum internal memory supported by processor: 16 GB
Memory types supported by processor: DDR3-SDRAM
Memory clock speeds supported by processor: 1066,1333 MHz
Memory channels: Dual-channel
Memory channels supported by processor: Dual
On-board graphics card: Yes
On-board graphics card model: Intel® HD Graphics
On-board graphics card base frequency: 733 MHz
Number of displays supported (on-board graphics): 2
Thermal Monitoring Technologies: No
Execute Disable Bit: Yes
Idle States: Yes
Market segment: Desktop
Maximum number of PCI Express lanes: 16
PCI Express slots version: 2.0
PCI Express configurations: 1x16, 2x8
Number of Processing Die Transistors: 382 M
Processing Die size: 81 mm2
Number of Graphics & IMC Die Transistors: 177 M
Graphics & IMC Die Size: 114 mm2
Supported instruction sets: SSE4.2
PCI Express CEM revision: 2.0
Physical Address Extension (PAE): 36 bit
Graphics & IMC lithography: 45 nm
CPU configuration (max): 1
Embedded options available: No
Export Control Classification Number (ECCN): 3A991
Commodity Classification Automated Tracking System (CCATS): NA
Intel® AES New Instructions (Intel® AES-NI): No
Intel Trusted Execution Technology: No
Enhanced Intel SpeedStep Technology: Yes
Intel® Hyper Threading Technology (Intel® HT Technology): Yes
Intel FDI Technology: Yes
Intel Dual Display Capable Technology: Yes
Intel® Clear Video HD Technology (Intel® CVT HD): Yes
Intel® Turbo Boost Technology: No
Intel® vPro™ Platform Eligibility: No
Intel 64: Yes
Intel Demand Based Switching: No
Intel VT-x with Extended Page Tables (EPT): Yes
Intel Enhanced Halt State: Yes
Intel Virtualization Technology (VT-x): Yes
Intel® vPro™ Technology: No
Product type: Processor
Supported memory types: DDR3-SDRAM
Bus speed: 2.5 GT/s
Product family: Previous Generation Intel Core i3 Processor
Maximum memory: 16.38 GB
Born on date: Q2'10
Processor core voltage: 0.6500-1.4000 V
Launch date: Q2'10
Product name: Intel Core i3-550 (4M Cache, 3.20 GHz)
Processor brand name: Intel Core i3
Status: Discontinued
Bus type units: GT/s
Bus bandwidth: 2.5
Last change: 63903513
Tcase: 72.6 °C
Processor package size: 37.5 x 37.5 mm
Intel® Virtualization Technology (Intel® VT): VT-x
Cache memory: 4 MB
Maximum internal memory: 16777 MB

Intel Core i3-550. Processor family: Intel® Core™ i3, Processor socket: LGA 1156 (Socket H), Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 16 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics card model: Intel® HD Graphics, On-board graphics card base frequency: 733 MHz. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, Number of Processing Die Transistors: 382 M. Package type: Retail box

Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® 64
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software._ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Intel® VT-x with Extended Page Tables (EPT)
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

  • Born on date
    Q2'10
  • Box
    Yes
  • Bus bandwidth
    2.5
  • Bus speed
    2.5 GT/s
  • Bus type
    DMI
  • Bus type units
    GT/s
  • Cache memory
    4 MB
  • Co2 Savings
    6.72
  • Commodity Classification Automated Tracking System (CCATS)
    NA
  • Compatible chipsets
    Intel® H55 Express, Intel® H57 Express, Intel® P55 Express, Intel® Q57 Express
  • Component for
    PC
  • Cooler included
    Yes
  • CPU configuration (max)
    1
  • CPU multiplier (bus/core ratio)
    24
  • Embedded options available
    No
  • Enhanced Intel SpeedStep Technology
    Yes
  • Execute Disable Bit
    Yes
  • Export Control Classification Number (ECCN)
    3A991
  • Generation
    5th Generation
  • Graphics & IMC Die Size
    114 mm2
  • Graphics & IMC lithography
    45 nm
  • Harmonized System (HS) code
    8542310001
  • Idle States
    Yes
  • Intel 64
    Yes
  • Intel Demand Based Switching
    No
  • Intel Dual Display Capable Technology
    Yes
  • Intel Enhanced Halt State
    Yes
  • Intel FDI Technology
    Yes
  • Intel Trusted Execution Technology
    No
  • Intel Virtualization Technology (VT-x)
    Yes
  • Intel VT-x with Extended Page Tables (EPT)
    Yes
  • Intel® AES New Instructions (Intel® AES-NI)
    No
  • Intel® Clear Video HD Technology (Intel® CVT HD)
    Yes
  • Intel® Hyper Threading Technology (Intel® HT Technology)
    Yes
  • Intel® Turbo Boost Technology
    No
  • Intel® Virtualization Technology (Intel® VT)
    VT-x
  • Intel® vPro™ Platform Eligibility
    No
  • Intel® vPro™ Technology
    No
  • Last change
    63903513
  • Launch date
    Q2'10
  • Market segment
    Desktop
  • Maximum internal memory
    16777 MB
  • Maximum internal memory supported by processor
    16 GB
  • Maximum memory
    16.38 GB
  • Maximum number of PCI Express lanes
    16
  • Memory bandwidth supported by processor (max)
    21 GB/s
  • Memory channels
    Dual-channel
  • Memory channels supported by processor
    Dual
  • Memory clock speeds supported by processor
    1066,1333 MHz
  • Memory types supported by processor
    DDR3-SDRAM
  • Number of displays supported (on-board graphics)
    2
  • Number of Graphics & IMC Die Transistors
    177 M
  • Number of Processing Die Transistors
    382 M
  • On-board graphics card
    Yes
  • On-board graphics card base frequency
    733 MHz
  • On-board graphics card model
    Intel® HD Graphics
  • Package type
    Retail box
  • PCI Express CEM revision
    2
  • PCI Express configurations
    1x16, 2x8
  • PCI Express slots version
    2
  • Physical Address Extension (PAE)
    36 bit
  • Processing Die size
    81 mm2
  • Processor ARK ID
    48505
  • Processor base frequency
    3.2 GHz
  • Processor brand name
    Intel Core i3
  • Processor cache
    4 MB
  • Processor cache type
    Smart Cache
  • Processor code
    SLBUD
  • Processor codename
    Clarkdale
  • Processor core voltage
    0.6500-1.4000 V
  • Processor cores
    2
  • Processor family
    Intel® Core™ i3
  • Processor frequency
    3.2 GHz
  • Processor generation
    Intel® Core™ i3
  • Processor lithography
    32 nm
  • Processor manufacturer
    Intel
  • Processor model
    i3-550
  • Processor operating modes
    64-bit
  • Processor package size
    37.5 x 37.5 mm
  • Processor series
    Intel Core i3-500 Desktop Series
  • Processor Socket
    LGA 1156 (Socket H)
  • Processor threads
    4
  • Product family
    Previous Generation Intel Core i3 Processor
  • Product name
    Intel Core i3-550 (4M Cache, 3.20 GHz)
  • Product type
    Processor
  • Status
    Discontinued
  • Stepping
    K0
  • Supported instruction sets
    SSE4.2
  • Supported memory types
    DDR3-SDRAM
  • System bus rate
    2.5 GT/s
  • Tcase
    72.6 °C
  • Thermal Design Power (TDP)
    73 W
  • Thermal Monitoring Technologies
    No
  • VID Voltage Range
    0.65 - 1.4 V
  • Производитель
    Intel
  • Тип товара
    Процессор
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